About Us
Company Profile
Brand Promise
Building Structure
Valuable Partners
Corporate Culture
Industries We Serve
CIS
DDIC
MCU
CIS Module Package
Laser Drilling
Manufacturing Capabilities
Capacity
Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
AVI
Quality Commitment
Division of Work
Quality Management
Quality Policy
Certification
Environment Control
Reliability Capability
Etc
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Manufacturing Capabilities

As one of the largest back-end toll processing company in Korea.

Home Manufacturing Capabilities Capacity

Capacity

High productivity can be utilized by combinational aspects of good working environment, member experience and system integration.
FuRex’s experience combined with these capabilities bring the unique ability to provide massively parallel experimentation for better and higher performance.

Manufacturing Capabilities Graph

CIS

Process Machine Maker Model Key Control Item
Lamination Dynatech DT_ECS2030 Tape Void, Burr, etc
CUON Solution CUWLA-120
Back Grinding TSK PG300RM Target Thickness
Roughness
Broken, Crack, etc
DISCO DGP8760
DGP8761
Laser grooving DISCO DFL-7161 Speed, RPM, Height, Chxipping, Particle, Pixel Damage, etc
Dicing TSK 3000T
DISCO DFD6361
Die Sort BESI
(Laurier)		 DS9000 / 9100 Map, Die-to-Die Gap. Rotation
Collet Damage, etc
DS9000E
QMC CCS-310
Cleaning DISCO DFD651 Pressure, TIme, etc
AVI CAMTEK Falcon Recipe, Visual Defects, etc
Condor
Eagle-1
STI I Focus 100

DDIC

Process Machine Maker Model Key Control Item
Lamination Dynatech DT-ECS2030 Tape Void, Burr, etc
CUON Solution CUWLA-120
Back Grinding DISCO DGP8761 Target Thickness, Roughness
Broken, Crack, etc
Wafer Mounting Dynatech DT-NWM1050DM Tape Void, Broken, Crack, etc
Back Marking
(Option)		 EO Tech CSM3000FC Wrong Mark, No Mark, Shift, etc
Plasma
(Option)		 Jesagi JSPCS-700M Time, etc
Dicing DISCO DFD6361 Speed, RPM, Height
Chipping, Particle, etc
DFD6340
TSK 3000T
300TX
AVI CAMTEK 530PD Recipe, Visual Defects, etc
520PD
UV Daesung DSUV-128 UV Intensity, etc
APS AJU Hitech AVS-8100 Map, Quantity, Iik Die, Collet Damage, etc
AP Tech APP-L10
JT Corp. JAP-3000
GPM KG-812-1B
Tray AVI JT Corp. JAI-D302 Recipe, Visual Defects, etc
Hon Tech HT-1200
Packing Unicom TAPIT_W Ⅱ+ Tape Banding condition, etc
Air Zero AZCW-750D MBB Vacuum sealing condition, etc
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