As one of the largest back-end toll processing company in Korea.
High productivity can be utilized by combinational aspects of good working environment, member experience and system integration.
FuRex’s experience combined with these capabilities bring the unique ability to provide massively parallel experimentation for better and higher performance.
Process | Machine Maker | Model | Key Control Item |
---|---|---|---|
Lamination | Dynatech | DT_ECS2030 | Tape Void, Burr, etc |
CUON Solution | CUWLA-120 | ||
Back Grinding | TSK | PG300RM | Target Thickness Roughness Broken, Crack, etc |
DISCO | DGP8760 DGP8761 |
||
Laser grooving | DISCO | DFL-7161 | Speed, RPM, Height, Chxipping, Particle, Pixel Damage, etc |
Dicing | TSK | 3000T | |
DISCO | DFD6361 | ||
Die Sort | BESI (Laurier) |
DS9000 / 9100 | Map, Die-to-Die Gap. Rotation Collet Damage, etc |
DS9000E | |||
QMC | CCS-310 | ||
Cleaning | DISCO | DFD651 | Pressure, TIme, etc |
AVI | CAMTEK | Falcon | Recipe, Visual Defects, etc |
Condor | |||
Eagle-1 | |||
STI | I Focus 100 |
Process | Machine Maker | Model | Key Control Item |
---|---|---|---|
Lamination | Dynatech | DT-ECS2030 | Tape Void, Burr, etc |
CUON Solution | CUWLA-120 | ||
Back Grinding | DISCO | DGP8761 | Target Thickness, Roughness Broken, Crack, etc |
Wafer Mounting | Dynatech | DT-NWM1050DM | Tape Void, Broken, Crack, etc |
Back Marking (Option) |
EO Tech | CSM3000FC | Wrong Mark, No Mark, Shift, etc |
Plasma (Option) |
Jesagi | JSPCS-700M | Time, etc |
Dicing | DISCO | DFD6361 | Speed, RPM, Height Chipping, Particle, etc |
DFD6340 | |||
TSK | 3000T | ||
300TX | |||
AVI | CAMTEK | 530PD | Recipe, Visual Defects, etc |
520PD | |||
UV | Daesung | DSUV-128 | UV Intensity, etc |
APS | AJU Hitech | AVS-8100 | Map, Quantity, Iik Die, Collet Damage, etc |
AP Tech | APP-L10 | ||
JT Corp. | JAP-3000 | ||
GPM | KG-812-1B | ||
Tray AVI | JT Corp. | JAI-D302 | Recipe, Visual Defects, etc |
Hon Tech | HT-1200 | ||
Packing | Unicom | TAPIT_W Ⅱ+ | Tape Banding condition, etc |
Air Zero | AZCW-750D | MBB Vacuum sealing condition, etc |