Wafer Processing
As one of the largest back-end toll processing company in Korea.
Auto Visual Inspection

Auto Visual Inspection
| Wafer Size Coverage |
8" / 12" |
| Clean Room |
Class 10 / Class 100 |
| Bad Die Recognition |
Wafer Map Exporting / Ink Dotting |
| Detectability |
1.0㎛ |
| Types of Defects |
- Metallization defects
- Glassivation, passivation defects
- Polyimide, BCB defects
- Embedded foreign material
- Dicing defects
- Bump defects
- Contamination defects such as liquid residues, surface particles, and adhesive residues
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