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Wafer Processing
As one of the largest back-end toll processing company in Korea.
Wafer Dicing
Wafer Dicing Process
| Wafer Size Coverage | Clean Room | Die Size Coverage | Maximum Chipout | Kerf Width | Pattern type | |
|---|---|---|---|---|---|---|
| Top | Back | |||||
| 8" / 12" | Class 10 / Class 500 |
|
< 15㎛ | < 50㎛ | The sizes vary depending on the product type | Bump / Non-Bump |
Address : 283, Sandan-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
Tel: 031-428-2500 Fax : 031-454-1172
COPYRIGHT(C) 2017 FuRex
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