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Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
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Wafer Processing

As one of the largest back-end toll processing company in Korea.

Back Grinding

FuRex Back Grinding Process

Wafer Size Coverage Clean Room Thin Wafer Target Thickness Thickness Tolerance after Grinding Roughness Rmax
8" / 12" Class 500 50㎛ ± 10㎛ ± 0.3㎛

FuRex Back Grinding

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