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Company Profile
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Building Structure
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Industries We Serve
CIS
DDIC
MCU
CIS Module Package
Manufacturing Capabilities
Capacity
Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
AVI
Quality Commitment
Division of Work
Quality Management
Quality Policy
Certification
Environment Control
Reliability Capability
Etc
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Quality Commitment

As one of the largest back-end toll processing company in Korea.

Reliability Capability

FuRex 는 정확하고 정밀한 분석을 위해 다양한 Testing 장비를 구비하고 있습니다.

  • Visual Inspection
    • Measuring micro

      Measuring micro

    • High power scope

      High power scope

    • Low power scope

      Low power scope

    • FE – SEM / EDX

      FE – SEM / EDX

  • Performance
    Test
    • Vibration

      Vibration

    • Drop

      Drop

    • Roughness

      Roughness

    • Thickness

      Thickness

  • Reliability
    Test
    • Thermal shock

      Thermal shock

    • Temp& Humidity

      Temp& Humidity

As you see, these are the examples of the scope of our reporting.
Having such feedback process we strive to find the issues as early as possible, respond to the issues as early as possible.

AVI output, Scope output (x500), SEM / EDX

Reliability

  • Temp& Humidity

    Vibration Tester
    Green Science
    Vibration 10~100HZ
  • Temp& Humidity

    Drop Tester
    ODM
    Max 1.7M
  • Temp& Humidity

    Temp
    & Humidity chamber
    SJ-109 (So Jung)
    -20℃ ~ +120℃ / 30 ~ 98%RH
  • Temp& Humidity

    Thermal
    Shock Chamber
    SJ-TS2 (So Jung)
    Temp range: -70℃ ~ +180℃
  • Temp& Humidity

    Pressure
    Cooker Tester
    PCT-48 (이레테크)
    Temp range: 80℃ ~ 130℃
  • Temp& Humidity

    Wire Bond Tester
    Dage4000 (Nordson)
    Wire bond pull,
    ball shear, die shear

Failure Analysis

Thermal Field Emission-SEM
(주사전자현미경)
Failure Analysis

- Model: JSM7610 (JEOL)
- Resolution : 1.0nm at 15kV, 1.5nm at 1kV
- Magnification: X25 to X1,000,000
- Accelerating Voltage : 0.1kV to 30kV

전자 빔이 표면에 집중되어 1차 전자만 굴절되고 표면에서 발생된 2차전자를 수집하여 그 신호들을 형상화 시키는 현미경으로서 시료 표면의 정보를 얻을 수 있습니다.
낮은 가속전압에서도 시편 관찰이 용이하여 전자 빔에 의한 시료의 손상을 최소화 할 수 있으며,
ESD 가 부착되어 있어 시편의 성분과 표면성분에 관한 연구를 수행할 수 있습니다.

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