furex

Wafer Processing

As one of the largest back-end toll processing company in Korea.

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FuRex Auto Visual Inspection

Auto Visual Inspection
Wafer Size Coverage	8" / 12"
Clean Room	Class 10 / Class 100
Bad Die Recognition	Wafer Map Exporting / Ink Dotting
Detectability	1.0㎛
Types of Defects	Metallization defects Glassivation, passivation defects Polyimide, BCB defects Embedded foreign material Dicing defects Bump defects Contamination defects such as liquid residues, surface particles, and adhesive residues