About Us
Company Profile
Brand Promise
Building Structure
Valuable Partners
Corporate Culture
Industries We Serve
CIS
DDIC
MCU
CIS Module Package
Manufacturing Capabilities
Capacity
Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
AVI
Quality Commitment
Division of Work
Quality Management
Quality Policy
Certification
Environment Control
Reliability Capability
Etc
contact us
close sitemap

Wafer Processing

As one of the largest back-end toll processing company in Korea.

Auto Visual Inspection

장비 외관검사를 통해 칩 표면 상 양/불을 판별하는 공정

FuRex Auto Visual Inspection

Wafer Size Coverage 8" / 12"
Clean Room Class 10 / Class 100
Bad Die Recognition Wafer Map Exporting / Ink Dotting
Detectability 1.0㎛
Types of Defects
  • Metallization defects
  • Glassivation, passivation defects
  • Polyimide, BCB defects
  • Embedded foreign material
  • Dicing defects
  • Bump defects
  • Contamination defects such as liquid residues, surface particles, and adhesive residues
Back to top