As one of the largest back-end toll processing company in Korea.
다이아몬드 날로 절삭하여 웨이퍼를 개별 칩 단위로 분리시키는 공정
Wafer Size Coverage | Clean Room | Die Size Coverage | Maximum Chipout | Kerf Width | Pattern type | |
---|---|---|---|---|---|---|
Top | Back | |||||
8" / 12" | Class 10 / Class 500 |
|
< 15㎛ | < 50㎛ | The sizes vary depending on the product type | Bump / Non-Bump |