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Wafer Processing
Back Grinding
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Wafer Processing

As one of the largest back-end toll processing company in Korea.

Wafer Dicing

다이아몬드 날로 절삭하여 웨이퍼를 개별 칩 단위로 분리시키는 공정

FuRex Wafer Dicing Process

Wafer Size Coverage Clean Room Die Size Coverage Maximum Chipout Kerf Width Pattern type
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8" / 12" Class 10 / Class 500
  • CIS : 2.585㎜*2.213㎜
  • DDIC : 0.6㎜*21.58㎜
  • MCU : 1.83㎜*1.83㎜
< 15㎛ < 50㎛ The sizes vary depending on the product type Bump / Non-Bump

FuRex Wafer Dicing

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