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Wafer Processing
As one of the largest back-end toll processing company in Korea.
Die Sort
Die Sort Process
절삭된 웨이퍼 내에서 양품 칩만을 링 프레임에 웨이퍼 형태로 재구성 시키는 공정
| Wafer-In Size | Ring-Out Size | Waffle Pack Size | Clean Room | Die-to-Die Gap | Die Rotation |
|---|---|---|---|---|---|
| 8" / 12" | 8" / 12" | 2" / 3" / 4" | Class 10 / Class 100 | ± 100㎛ | < 1° |
Address : 283, Sandan-ro, Danwon-gu, Ansan-si, Gyeonggi-do, Republic of Korea
Tel: 031-428-2500 Fax : 031-454-1172
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