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Lineup By Process
Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
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Wafer Processing

As one of the largest back-end toll processing company in Korea.

Die Sort

절삭된 웨이퍼 내에서 양품 칩만을 링 프레임에 웨이퍼 형태로 재구성 시키는 공정

FuRex Die Sort Process

Wafer-In Size Ring-Out Size Waffle Pack Size Clean Room Die-to-Die Gap Die Rotation
8" / 12" 8" / 12" 2" / 3" / 4" Class 10 / Class 100 ± 100㎛ < 1°

FuRex Die Sort

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