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Wafer Processing
Back Grinding
Wafer Dicing
Die Sort
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Wafer Processing

As one of the largest back-end toll processing company in Korea.

Back Grinding

반도체 패키지 경량화를 위해 웨이퍼 뒷면을 휠을 이용하여 연삭, 연마함으로써 웨이퍼 두께를 줄이는 공정
연삭 후 절삭 공정 진행을 위해 테이프가 부착된 링 프레임에 웨이퍼를 접착시킴

FuRex Back Grinding Process

Wafer Size Coverage Clean Room Thin Wafer Target Thickness Thickness Tolerance after Grinding Roughness Rmax
8" / 12" Class 500 50㎛ ± 10㎛ ± 0.3㎛

FuRex Back Grinding

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